HARDWARE 4 months ago by Hassan Mujtaba
NVIDIA will be introducing their next generation Pascal GPU in 2016 which will introduce several new and key technologies to the green team. The Pascal GPU will be the successor to the current generation Maxwell GPU and from the looks of it, it is going to be a beast of a chip. Featuring the latest HBM2 and 16nm FinFET based designs, Pascal GPUs will leverage NVIDIA’s dominance in both the consumer and corporate world.
NVIDIA Pascal GPU Might Feature 17 Billion Transistors, Almost Twice The Transistors of Fiji
In an exclusive report published by Fudzilla, the site reveals that NVIDIA’s next generation Pascal GPU will feature 17 billion transistors crammed inside its core. Currently, the flagship GM200 core found on the GeForce GTX Titan X comes with 8.0 Billion transistors while the competitor, the Radeon R9 Fury X has a total of 8.9 Billion transistors inside its Fiji GPU. The 17 Billion transistors on the Pascal GPU are twice the transistors found on the GM200 Maxwell and the Fiji XT GPU core which is literally insane. Pascal is meant to be NVIDIA’s next high performance, compute focused graphics architecture which will be found on all market segments that will include GeForce, Quadro and even Tesla. Based on TSMC’s 16nm process node, NVIDIA’s Pascal GPU will not only feature the best performance in graphics but also the most power efficient architecture ever made by a GPU manufacturer.
It was revealed a few days ago that NVIDIA’s Pascal GP100 chip has already been taped out on TSMC’s 16nm FinFET process, last month. This means that we can see a launch of these chips as early as Q2 2016. Given that the transistor count is correct, we can expect a incremental performance increase from Pascal across the range of graphics cards that will be introduced.
TSMC’s 16FF+ (FinFET Plus) technology can provide above 65 percent higher speed, around 2 times the density, or 70 percent less power than its 28HPM technology. Comparing with 20SoC technology, 16FF+ provides extra 40% higher speed and 60% power saving. By leveraging the experience of 20SoC technology, TSMC 16FF+ shares the same metal backend process in order to quickly improve yield and demonstrate process maturity for time-to-market value.